Revised Syllabus For M.Sc. Electronic Science To be implemented from June 2009 Of Pune University

1) Title of the course: M.Sc. Electronic Science Part II ( Colleges))
2) Introduction: M.Sc. Electronic Science in colleges follows the pattern of University
Courses and Departmental Courses. During semester III one theory course and two
practical courses are to be completed as university courses and two theory courses as
departmental courses to be conducted by the corresponding college. Similarly at the
semester IV one theory course and project course equivalent to two courses are to be
completed as university courses and two theory courses as departmental courses to be
conducted by the corresponding college.
At the post graduation level focus is on in-depth knowledge and specializations. The
research and development approaches are to be cultivated with exposure to current
and futuristic requirements of the industry and society at large. The post graduate
centers have choice to develop departmental courses with specific goal. The projects
can also be conducted corresponding to these theory courses in such a way that, the

P.G. Center has orientation in particular domain.
3) Aims and Objectives :
The aim of the Post graduate course is to prepare students for directly becoming
suitable for on-site industry jobs. Due weightage is given to incorporate latest
industrial trends and technologies in the syllabus with rigorous involvement of
practical training.
Following are the objectives –
i) To have adequate theory knowledge in the subject area like process control,
power electronics, Digital Signal processing, Embedded systems,
Optoelectronics, Communication systems, data communication etc.
ii) To introduce with various application fields of electronics like Agriculture,
automotive, Biomedical and mechatronics etc.
iii) To have practical knowledge in these subjects.
iv) To have ability of conducting an independent project on identifiable topic.
4) Eligibility: M.Sc. Electronic Science Part I Pass / ATKT.
5) Examination –
A) Pattern of Examination :
i) Semester and Practical
Theory Papers - Three Theory papers of 100 marks per semester
(Internal examination 20 +
Semester Examination 80, Total 100)
Practical - At the end of Semester III 100 marks Examination.
(Internal examination 20 +
Semester Examination 80, Total 100)
Project: At the end of Semester IV 100 marks Examination
per project course (Total 200 Marks)
(Internal examination 20 +
Semester Examination 80,
Total 100 for each project course)
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ii) Pattern of the question Paper:
The pattern adopted for theory and practical examination is as below.
Theory: The topic wise weightage is decided as per lecture allotted
to cover the syllabus for the topics. The Internal option is also
taken into consideration in the process. Equal weightage is given
for each topic, and none of the topic can be put up as option by
the student for examination.
Internal Examination 20 Marks
Four types of questions – Objective, problems, short answer
There are two or three different sets of the question papers used
for internal examination in the same class for same paper.
It is continues evaluation process and is executed by the teacher
conducting the course.
External Examination 80 Marks
Pattern is as follows-
Q.1 16 marks
Q.2 16 marks
Q.3 16 marks
Q.4 16 marks
Q.5 16 marks
Questions are to be set with equal weightage to all the topics
in the syllabus. Adequate Problems must be included.
Practical : Internal Marks 20 : Continuous assessment
External Examination 80 Marks: – Have to perform one experiment
of 80 marks of the duration 3 hours .
Standard of passing: Candidate must score 40% marks at the semester
examination in each course.
i.e. 32 marks at semester theory paper
32 marks at the practical course
There is no separate passing for internal course,
however the total marks of internal and external
should cross 40% of the total marks to be awarded
for the paper.
B) ATKT Rules : As per University statues
C) Award of Class: It will as per University rules as –
Above 70% First class with distinction
Between 60% to 70% First Class
Between 50% to 60% Second Class
From 40% to 50 % Pass class.
D) External Students: Not applicable for this course. External Students are not
admitted for the course.
E) Setting of Questions paper/ Pattern of Question paper:
Setting of the question paper is as per University Schedule and it is
centralized system adopted by University of Pune. Pattern of question paper
will be as per decided by Board of Electronic Science, University of Pune.
F) Verification of Revaluation : As per University Statues and rules for
verification and revaluation of marks in stipulated time after declaration of the
semester examination result .
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6) Structure of the course :
i)
a) Compulsory Papers : Four theory papers
b) Optional Paper : Nil
c) Question paper : Theory -
For Internal Examination 20 Marks
For Semester Examination 80 Marks
Practical “
For Internal Examination 20 Marks
For Semester Examination 80 Marks
ii) Medium and Instructions: ENGLISH
7) Equivalence subject/Paper and Transitory Provision:
OLD Syllabus New Syllabus
EL3UT 05 DSP systems & applications EL3UT 05 Embedded Systems
EL4UT 06 Control System: Theory &
application
EL4UT 06 Control System: Theory
& application
EL3UP 05 Practical Course V EL3UP 05 Practical Course V
EL3UP 06 Practical Course VI EL3UP 06 Practical Course VI
EL3UP 07 Project Course I EL3UP 07 Project Course I
EL4UP 08 Project Course II EL4UP 08 Project Course II
8) University Terms: More than 75% attendance is necessary for the course as per
University statues.
16 Weeks will be available for completion of theory course.
Practical course will be throughout the year.
9) Subject wise Detail Syllabus and Recommended books:
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M.Sc. Electronic Science Part II
Semester III and IV
Course Structure
ELUT: University Theory: Compulsory
EL DT: Departmental Course (Any four from list: From EL DT 01 to EL DT 13)
EL UP: University Practical: Two courses per semester.
SEM III SEM IV
EL3UT 05 Embedded Systems EL4UT 06 Control System: Theory &
application
ELDT Departmental Course ELDT Departmental course
ELDT Departmental Course ELDT Departmental Course
EL3UP 05 Practical Course V EL4UP 07 Project Course I
EL3UP 06 Practical Course VI EL4UP 08 Project Course II
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M.Sc. Electronic Science Part II
Semester III and IV
List of Departmental Courses
Course No Course Name
ELDT01 Data Communication and Networking
ELDT02 Optoelectronics
ELDT03 Advanced Power Electronics
ELDT04 Mechatronics
ELDT05 Advanced Embedded Systems
EL DT 06 Digital Image Processing
ELDT07 Printed circuit board technology.
ELDT8 Television and Systems
ELDT09 Material properties & Fabrication
techniques
ELDT10 Biomedical Instrumentation
ELDT11 Electronics & Computers in Agriculture
EL DT12 Automotive Electronics
EL DT 13 DSP systems and applications
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M.Sc. Electronic Science Part II
University courses
SEM – III and IV
(To be implemented from June 2009)
EL4 UT05 Embedded Systems
Objectives:
1. Define Embedded system
2. Describe applications of embedded systems.
3. Understands the architecture, assembly & Interfacing of different 8-bit
microcontrollers
4. Learn software techniques to embed codes in to the systems
5. Learn to develop systems that make optimum use of available system resources
1. Embedded Systems overview (10)
An embedded system, features of embedded system, components of embedded system,
examples of embedded system application.
Review of Microprocessor family, 8-bit Micro-controllers (Atmel), Architecture(Harvard
and Van-Neuman Architecture ), Instruction set, Memory organization, Design of target
board, Interfacing techniques, Timers, Interrupts I/o pins, Timers, interrupts, serial
interface. Processors in embedded systems (RISC, CISC)
2. Embedded system Hardware: (10)
Interfacing: I/O devices (LCD, Keyboard, ADC, DAC, Stepper motor, PWM etc), Data
converters, DMA, UART, SPI, PWM, WDT, Memories, serial, parallel Asynchronous
and synchronous communication.
Communication standards: – RS 232, I2C, USB, SPI, CAN, PCMCIA, IrDA.
3. Development tools for embedded systems: (06)
Software development tools- Editor, Assembler, linker, simulator, compiler
Hardware development tools: programmer (EPROM programmer, microcontroller
programmer, universal programmer), Logic analyzer, General purpose evaluation Boards.
Hardware and Software combination Tools-
1. In circuit emulator 2. Debugger.
4. PIC micro-controllers: (08)
Overview and features (16F877A), Architecture, memory organization interrupts, inbuilt
controller features (ADC, PWM and Timer)
Assembly instruction set and introduction to C programming
Interrupt programming, keyboard and LCD programming, ADC, DAC programming.
5. AVR micro-controllers: (08)
Overview and features (8335), Architecture, memory organization interrupts, inbuilt
controller features (ADC, PWM and Timer)
Assembly instruction set and introduction to C programming, interrupt programming,
keyboard and LCD programming, ADC, DAC programming.
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6. Embedded C Programming: (08)
C programming for microcontrollers, optimizing techniques, Interrupt sub, routines, Data
types and time delays in 8051, I/O programming, logic operation, data conversions, data
serialization using 8051,Timer programming, serial port programming (RS-232, I2C,
USB, SPI, CAN), interrupt programming, keyboard and LCD programming, ADC, DAC
programming.
Applications: Relay, PWM, DC and Stepper motors. 8
Text Books:
Embedded Systems – Rajkamal
The 8051 Microcontroller and Embedded Systems- Mazidi
Design with PIC Microcontrollers- John Pitmann
Embedded C Programming & Atmel AVR – Richard Barnett – Thomson
Publication
Reference Books:
Programming & Customizing 8051 Micro controller – Myke Predko
8051 Microcontroller Programming- Haung
Embedded Microcomputer systems: Jonathan W Valvano – Thomson Publication
An Embedded Software Primer by David E. Simon. Publisher: Addison- Wesley. ISBN
0-201-61569-X. Copyright 1999.
Programming in C" by Stephen Kochan. Publisher: Hayden Books/Macmillan
Programming & Customizing The AV R microcontroller- Dhananjay V Gadre
Embedded microcontroller System – Jonathan Valvano.
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EL4 UT06 Control systems: Theory and Applications
Objectives:
1. To make the student familiar with basic concepts of control theory.
2. Understanding open and close loop control.
3. To understand the theoretical background with an emphasis on problem solving.
4. Make the students aware of working knowledge of PLC and its programming.
5. To impart adequate awareness of actuators and anunciators used in industrial control
systems.
Basic control system: (04)
Functional elements of control system, Continuous and discrete state control systems,
Open and closed loop systems. Control strategies: feedback, feed forward and adaptive
control.
Laplace transform in control systems: (04)
Mathematical models of systems, transfer function, Block diagram of control
system and rules for its reduction, analysis of multiple input multiple output systems.
3: Stability of control systems. (06)
Concept of stability, closed loop poles and stability, Routh-Hurwitz criterion ,Routh’s
stability criterion, root-locus band frequency response methods of control system
analysis. Bode and Nyquist plots. Open-loop transient response method and Ziegler-
Nichols methods of process loop tuning.
4: Rapid overview: (04)
ON/OFF control, proportional integral and derivative control modes. Definitions of
related terms, PI, PD and PID controllers and their applications.
5: Programmable logic controller (12)
PLC operation, input and output status files, fixed PLCs. Sixteen-point I/O modules
with decimal addressing, I/O interaction with input and output status files, PLC memory
(system and application), data formats. Putting together a modular PLC. Conventional
ladder Vs PLC ladder logic. Examples of ladder diagram development. Programming a
PLC. Programming Terminals, Open PLC systems. Soft PLC or Open Architecture
control.
6. PLC Processors: (12)
Processor’s function, Operating system. Scanning 4 general Electric series
90-30 PLC, Omron Sysmach CQMI Programmable controller, WDT, Processor Ports.
Serial communication between a PC and PLC. Interfacing to non- RS232 PLC
Processors, Processor Operating Modes.
Choosing the correct Processor for a particular Application.
Program and data organization inside PLC processor,
Understanding relay instructions and PLC in out modules. Timing and counter
Instructions. Comparison and data handling instructions. Sequencer instructions.
Documenting the system.
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7: Brief Overview : (08)
Principle and Characteristics of Synchro-Servo motors,
Control Valves, Solenoids, Indicators, Anunciators, Alarms, Recorders.
Discussion of Control System Examples such as Bottling Plant, Coffee Vending
machine, Heat Exchanger, Boiler control etc.
Text Books:
1. Modern Control Engineering by Katsuhiko Ogata; Prentice Hall-EEE.
2. Process Control by Peter Harriot. TMH Delhi.
3. Introduction to Programmable Logic Controllers by Gary Dunning; Delmar
(Thomson Learning)
4. Process Control Instrumentation Technology by Curtis D. Johnson; PHI
5. Control System Engineering by Nagrath, M. Gopal; New Age International LTD.
6. Control Systems by U. A. Bakshi, V. U. Bakshi; Technical Publication, Pune.
7. Automatic Control Systems by B. C. Kuo; PHI
8. Industrial Electronics by T. E. Kissel; PHI
9. Control Engineering Theory & Practice by N. M. Bandopadhyay, PHI
Reference books:
1. Instrument Engineers Handbook- Process Control by B. G. Liptak
2. Microprocessor with application in Process Control by S. I. Ahson, TMH Co.
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Departmental course SEM – III and IV
(To be implemented from June 2009 )
EL DT 01 Data Communication and Networking
1. Transmission of digital data (05)
Interfaces and MODEMS ,Transmission Media , multiplexing , error detection
and correction , data link control , data link protocols.
2. Network Basics: (05)
Network , OSI reference model
3. Network Hardware : (10)
Network Interface Adapters , Cabling a Network , Wireless LAN , Network
connection Devices , Wide Area Networking , Server technologies , Designing a
network , routing fundamentals.
4. Network Protocols : (05)
Ethernet Basics , Fast Ethernet and Gigabit Ethernet , Token passing protocols ,
TCP/IP , Netware protocols , Net BIOS , Net BEUI and Server message blocks .
5. Network operating systems : (10)
Windows 2000 and Windows NT , Active directory , Windows NT domains ,
NOVEL Netware , NOVEL directory services , UNIX , LINUX , Network clients
6. Network connection services : (05)
DHCP , WINS and Net BIOS name resolution , The domain name system
7. Network services : (10)
Internet Services , Network printing , connecting to the internet , internet security ,
Network Administration : Windows Network Administration , Network management
and troubleshooting tools , backing up of index.
Reference Books.
1. Networking the complete reference , Zacker , Mc Graw Hill , 2001.
2. Data Communication and Networking , Forouzan ,Behrouz A . , 2nd Edition ,
Mc Graw Hill , 2004
3. Data Communication and Networking : Achut S godbole , McGraw Hill, 2002
4. Networking Handbook : Taylor , McGraw Hill
5. Data Communication and Computer Networks , Brijendra Singh , 2nd Edition ,
PHI publication.
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EL DT 02: Optoelectronics
Objectives: After undergoing this course the student will have –
1.Awareness of different optoelectronic devices and systems.
2.Knowledge of optical fiber communication system.
3.Study of Optical Fiber sensors and their applications.
1: Basic Optics [04]
Natural, artificial and specialized light sources, Characterization of light sources
based on intensity spectrum, emission, spatial distribution, conversion efficiency.
Experimental methods for studying these characteristics use of optical filters, their
disadvantages and necessity and use of monochromatic source, wave nature of light,
Reflection and refraction, Snell’s law, Total internal reflection.
2: Light Sources [12]
Study of LED’s: variable band gap semimatreial idea of hetero – junction, simple and
double heterostructure light sources, quantum efficiency, internal and external quantum
efficiency, expression for total and internal quantum efficiency, reasons for external
quantum efficiency to be less than internal quantum efficiency, intensity distribution of
Led, Lambertial sources, encapsulation of LED’s, types of LED’s surface and edge
emitting, Burus LED.
Study of LASER: LASER as an amplifier of light and necessary conditions for
amplification, special properties of LASER- monochromatic, coherent and light power
nature, directionality, divergence and attenuation of LASER beam. Study of three level
LASER (Ruby LASER), Study of four level laser, study of tunable laser, semiconductor
laser and applications of high power, low power continuous wave and pulse lasers
3: Light detectors [10]
Idea of light detectors and their basic types, natural and specialized light detectors, type of
specialized light detectors, thermal, quantum light detectors, types of quantum photo
detectors, photo resistive, photovoltaic, photo emissive detectors. Study of quantum
detectors-photoelectric cell, photomultiplier tube, photodiode, important characteristics of
light detector-spectral response, viewing angle, efficiency, and material used for
photodetecors.
4: Optical Fiber –Theory and applications. [12]
Action of optical fiber as wave guide, Advantages of optical fiber communication
over normal medium, necessary conditions for wave guiding mechanisms of optical
fibers, construction of optical fiber cable, role of strength of material, types of optical
fibers. Step index and graded index fibers, comparison of wave guiding action of both
expression for angle of acceptance and cone of acceptance, numerical aperture, time
dispersion, splicing and fiber connections- what is splicing, requirements of splicing,
practical methods of splicing, various types of optical fiber connectors, losses in optical
fiber communication. Losses due to fibers, intrinsic and extrinsic losses, intrinsic losses
due to atomic scattering and molecular absorption. Expression for loss factor, extrinsic
losses due to mechanical effects, micro bends, cracks etc. losses due to connectors, core
longitudinal, angular misalignment, mismatch of rate indices of fiber material etc.
Comparison between losses due to splicing and connectors. Expression for
Electromagnetic wave guided by fiber, modes of transmission, expression to ‘V’ number
and number of maximum modes of transmission, dispersion in optical fibers, wavelength
and time dispersion, internodes dispersion, double crucible and chemical deposition
methods of manufacturing of optical fibers
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5: Optical fiber systems- [06]
Optical transmitter/receiver circuits, driver circuits for LED, detector circuit design
using photodiode, phototransistors, and fiber choice.
Communication special fibers – DS fiber, NZDS fiber, integrated optics, slab and strip waveguide,
and Electro-optic devices – phase shifters, interferometer modulators.
6: Measurement on Optical fiber – [06]
Optical fiber experimental setup, launching light into fiber, detection etc.
Fiber attenuation measurement, dispersion measurement profiles measurement, numerical
aperture measurement, diameter measurement.
Text Books
1. Optoelectronics- Kaiser, TMH (1992)
2. Optical fiber communication- Principles and practice, J.M. Senior, PHI (1990)
Reference Book
3. Optoelectronic- an Introduction, J. Wilson and J.F.B. Hawakes, PHI (1992)
4. An introduction to fiber optics: Ajoy Ghatak, K.Thygarajan, Cambridge University
Press (1998).
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EL DT03: Advanced Power Electronics
Objectives:
To study the principles and applications of power electronics with
different topologies.
1. Understand the solid-state devices required for power electronic circuits.
2. To study the basic power circuits.
3. To study and understand the power conversion and power transmission principles.
4. To study the control schemes of power circuits.
5. To study the industrial and domestic applications.
1 : Introduction (04)
Power Electronics and linear electronics, power devices, power circuits, concept
of load, Application areas. Basic concepts of electrical and magnetic circuits
2: Power Devices (08)
Power diodes: I-V characteristics, switching characteristics, types, SiC diodes,
SPICE model, diode circuits.
Power BJT: Steady state and switching characteristics, switching limits, spice
model
Power MOSFETs: Steady state and switching characteristics, COOLMOS, SITS,
IGBTs, Spice models, switching limits.
Thyristor: Characteristics, two-transistor model, turn-on and turn-off methods,
Thyristor types and their comparison, spice models.
3: Power Circuits (20)
Diode circuits: single phase half-wave, center tapped full wave and bridge
rectifiers performance parameters, three phase bridge rectifiers.
Controlled rectifiers: Single phase and three phase – half-wave, semi-full wave
and dual converters, Single phase series converters, 12-pulse converters, Power
factor improvement techniques.
AC voltage controllers: ON-OFF control, phase control, single phase
Bidirectional controller, 3-phase Bi-directional controller and their types, PWM
control.
Single phase and 3- phase cycloconverter and their types.
DC-DC converters: step-up and step-down converters, performance parameters,
converter classification.
Switch mode regulators: Buck, Boost, Buck-Boost and Cuk regulators,
Multioutput Boost-converter.
Inverters: Performance parameter, single-phase bridge inverter.
3- Phase inverters: 180° and 120° conduction, voltage control methods for single
phase and 3-phase inverters, harmonic reduction, current source inverters,
variable dc- link inverters, Boost inverters.
Introduction to resonant pulse and multilevel inverters
Static Switches: Single phase and three phase AC switches, three-phase reversing
switches. AC switches for Bus transfer, DC switches. Solid state and
Microelectronic Relays.
14
4: Applications (12)
DC power supplies: switch mode DC power supplies, flyback, forward, push pull,
half bridge, full bridge-converters, resonant DC power supplies, bi-directional
power supplies
AC Power supplies (UPS): switch mode AC Power supplies, resonant and bidirectional
AC Power supplies
DC drives: Basic characteristics of DC motors, Operating modes, single phase
and 3 phase drives, DC –DC converter Drives, Closed loop control of DC drives
AC drives:
Induction motors drives: squirrel cage and wound rotor motor, Performance
characteristics control methods, Closed loop control methods
Synchronous motor drives: cylindrical rotor, silent mode, Reluctance, Permanent
magnet, switched reluctance- motors, control methods, Closed loop control
methods
Brushless DC and AC Motors and Control Stepper Motor – Types and Control
Electric Utility Applications: High voltage DC transmission, flexible AC
transmission systems: shunt and series compensators
Other Applications: Integral half cycle /cycle control, space heating and air
conditioning, HF fluorescent lightning, Induction and capacitive heating
4: Practical Design Considerations (06)
Snubber circuits for diodes, SCRs and transistors, Turn-on and turn-off and over
voltage snubbers.
MOSFET gate drive, BJT base drive, Isolation methods, thyristor firing and
gating circuits drive IC’s for converters, high voltage drive for motor. Control
Circuits: Current mode and voltage mode PWM
Cooling and heat sinks, reverse recovery transients, supply and load side
transients, Selenium diodes and MOVs for voltage protections.
Current protection methods
EMI standards, sources and shielding methods.
`
Reference books:
1. Modern power electronics and ac drives :Bimal k Bose
2. Power electronics :Ned, mohan, undeland, Robbins
3. Power electronics :Lander
4. Power electronics :M. Rashid
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EL DT04: Mechatronics
Objectives:
1. Analysis, Design, Synthesis and selection systems that combine electronic and
Mechanical components with Modern control and microprocessors.
2. To make students aware about the role of Electronics in Mechatronics.
1. Introduction to Mechatronics. (04)
Mechanical system components and modeling, mechanical system and design,
Mechatronics approach, control, design process, load conditions, flexibility, man
machine interface.
2. Mechatronic Components. (08)
Sensors and instrumentation systems, embedded systems, drives and actuators, control
devices, linear systems, rotational drives, motion converters, motion control devices,
pilot devices, control circuits and load circuits, fuses and circuit breakers, enclosures,
conductors, lockout tag and safety.
3. Robotics. (04)
Classification of robots, applications.
4. Systems of a Robot. (06)
Basic components of robot system, functions of robots, robot specifications.
Mechanical systems: review of elementary mechanical concepts, motion conversion,
and modeling of mechanical systems, end effectors, resolution, repeatability, accuracy
of manipulators.
5. Control of Actuators in Robotics. (06)
Closed loop control in position servo, effect of friction and gravity, frequency domain
considerations, control of robotic joints.
6. Sensors and Actuators. (08)
Actuators: stepper motors, DC motors, brush less DC motors, direct drive actuators,
hydraulic actuators, pneumatic actuators, servo amplifiers.
Sensors: position sensors (non optical and optical), velocity sensors, proximity sensors,
accelerometers, touch and slip sensors, force and torque sensors.
7. Transformation and Kinematics. (08)
Homogenous co-ordinates, co-ordinate reference frames, properties of transformation
matrices, homogenous transformations and manipulator, forward solution, back
solution, motion generation, Jacobean, controller architecture.
8. Role of Computers in Robotics. (06)
Imaging, image representation, picture coding, object recognition and categorization,
control-using computer. 6
Reference Books:
1.Mechatronics: Bradley, Dawson, Burd, Loader.
2. Robotic Engineering: R.D. Klafter, M.Negin,T.A.Chmielewski.
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EL DT05: Advanced Embedded Systems
Objectives:
1. Define Embedded system
2. Describe applications of embedded systems.
3. Understands the architecture, assembly & Interfacing of different 16-bit and 32-bit
microcontrollers
4. Learn software techniques to embed codes in to the systems
5. Learn to develop systems that make optimum use of available system resources
1. Software engineering practices in embedded systems: (02)
Process life cycle, models, and analysis design implementation, testing validating
and debugging.
2. Architecture of 16 and 32-bit Processors Embedded Processors (16)
Introduction to 16 and 32-bit Processors, Difference between RISC and CISC
Architecture
ARM Controllers- ARM Architecture and Memory Organization, Pipelining and
cache concepts, 32 and 16 bit operating modes, Programming Model, ARM and
Thumb Instruction Set, Exception Handling, Simple ARM programs. Assembly and
C- programming (GNU Tools)
Study of examples of ARM and RISC family Microcontroller: LPC2104/05/06 or
LPC2148 or any equivalent
3 RTOS Concepts (10)
Inter process communication and synchronization of processes, Tasks, and Threads
Multiple process in an application, problem of sharing data by multiple tasks and
routines
Inter process communication: process, threads, task, semaphores, mailbox queues,
4 Real time operating system (RTOS) (14)
Program modeling concept in single and multiprocessor systems,
Real Time Operating System: Introduction to real-time, hard vs. soft real systems,
classic unit processor scheduling, static and dynamic scheduling, OS functions needed
for real time computing.
Operating system services, I/O subsystem, network operating system, Real time and
embedded system, operating system, interrupt routines in RTOS environment
Introduction to Embedded Linux internals, Linux kernel for device drivers and
embedded system
5 Real time operating system (RTOS) programming tools (08)
Overview of Micro C/OS-II: need of well tested and debugged Real time operating
system (RTOS), use of Micro C/OS with examples.
Text Books:
1. Embedded Systems – Rajkamal
2. ARM system – on chip Architecture: Steav Furber, Wesley Publication
3. Real time systems: Jane Ws Liu, person Publication
4. Micro C/OS- II, The real time Kernal : Jean Labrose R & D technical Books
Reference Books:
1. Embedded Microcomputer systems: Jonathan W Valvano – Thomson Publication
2. An Embedded Software Primer by David E. Simon. Publisher: Addison- Wesley.
ISBN 0-201-61569-X. Copyright 1999.
3. Programming in C" by Stephen Kochan. Publisher: Hayden Books/Macmillan
4. Computer Book Publishing Division. ISBN 0-672-48420-X. Copyright 1988.
5. Programming & Customizing The AV R microcontroller- Dhananjay V Gadre
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6. Embedded microcontroller System – Jonathan Valvano.
EL DT 06: Digital Image Processing
Objectives:-
1. To make students aware of basic mathematics needed for Digital Image
Processing.
2. To train the students for software required for Digital Image Processing.
3. To get the students acquainted with the various algorithms involved in Digital
Image Processing.
1.Introduction (05)
Digital image processing- problems and applications, image representation and modeling;
image enhancement, image restoration, image analysis, image reconstruction from
projections, image data compression
2. Image perception (05)
Light, Luminance, Brightness and Contrast; MTF of the visual system, the visibility
function, monochrome vision models, image fidelity criteria, color representation, color
matching and reproduction, color coordinate systems, color difference measures, color
vision model, temporal properties of vision.
3. Image sampling and quantization (08)
Two dimensional sampling theory, extensions of sampling theory, practical limitations in
sampling and reconstruction, image quantization, the optimum mean square of Lloyd –
max quantizer, a compandor design, the optimum mean square uniform quantizer,
examples comparison and practical limitations, analytic models for practical quantizer,
quantization of complex Gaussian random variables, visual quantization.
4.Image Enhancement (06)
Point operations Histogram modeling, Spatial Operations, Transforms Operations
Multispectral Image Enhancement, False color and Pseudo color, Color Image
Enhancement
5. Image Filtering and restoration (12)
Image observation Models, Inverse and Weiner filtering, Finite Impulse Response(FIR)
Weiner Filters, Other Fourier Domain Filters, Filtering Using Image transforms,
Smoothing Splines and Interpolation, Least Square filters, Generalized Inverse, SVD, and
Iterative methods, Recursive Filtering for state Variable Systems, Causal Models and
recursive filtering, Semi causal Models and Semi recursive Filtering, Digital Processing
of Speckle Images, Maximum Entropy Restoration, Baysian Methods, Coordinate
Transformation and Geometric Correction, Blind Deconvolution, Extrapolation of Band
limited Signals.
6.Image Analysis and Computer Vision (08)
Spatial feature extraction, Transform Features, Edge Detection, Boundary Extraction,
Boundary Representation, Region Representation, Moment Representation, structure,
shape features, Textures, Scene Matching and Detection, Image Segmentation,
Classification Techniques, Image understanding.
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7.Overview of Image Data Compression (06)
Pixel Coding, predictive Techniques, RLE,LZW compression, comparison of various
image file formats, TGA, GIF, TIFF, BMP, JPEG, CDR.
REFERENCES
Textbooks
1. K. R. Castleman, Digital Image Processing, Prentice-Hall, 1996
2. A.K. Jain, Fundamentals of Digital Image Processing, Prentice-Hall, 1989
3. A.B. Chanda, Dutta Majumdar , Digital Image Processing, Prentice-Hall, 2000
4. Dawyne Philips, Image processing in C: Analyzing & enhancing Digital images,
BPB Publications
Recommended Further Reading
1. J. S. Lim, Two-Dimensional Signal and Image Processing, Prentice-Hall, 1990
2. R. C. Gonzalez and R. E. Woods, Digital Image Processing, Addison-Wesley
1993
3. E. Dudgeon and R. M. Mersereau, Multidimensional Digital Signal Processing,
Prentice-Hall, 1984
4. Josef Kittler & Michael Duff, Image Processing & system Architecture, Research
studies Press
5. Image Processing , Pearson Education India
19
EL DT07 : Printed circuit board technology.
Objectives:-
1. To make the students aware of the different industry procedures in PCB making.
2. To determine the problems involved in making a good PCB.
3. To make the student aware of the issues of making PCB for high frequency operation.
1. Manufacturing and Fabrication Technology (06)
Introduction to a Printed Circuit Board. Manufacturing: Fabrication Technologies,
Defining Fabrication Limits, Drawing, The Fabrication Process. Design for Assembly,
Soldering a Thru-Hole Component. Quality Solder Joints. Determining the Annular
Ring for Assembly. Component Spacing. Component Placement. Manual Assembly vs.
Auto Assembly. Single-Sided Assembly vs. Double-Sided Assembly. Manual
Assembly, Auto Assembly.
2. Introduction of PCB Designing Tools (12)
Schematics and the Netlist, Schematic Entry. Understanding Electricity. Software
Terminology (Orcad, Protel). Understanding Components. Schematic Standards.
Schematic Design Checklist. Schematic Styles, Sheets and Strategies. Connectors and
Sheet Connectors. Designing a PCB, Initial Design Determination, Using Tools of the
Trade.
Utility tools
Determining the Material Type to Use. Designing the Board. Libraries, Components,
and Data Sheets, Understanding Components. Component Consistency. Component
Symbol Types. Library Naming Convention. Manufacturer-Generic vs. Manufacturer-
Specific Components. Drawing the Components. Board Completion and Inspection.
CAD Tools
Technical Inputs to the CAD System for SM Circuits, Technical Outputs from the CAD
System for SM Circuits, Inputs/Outputs from CAD for Planning and Costing
Production
3. PCB design for SMDs (10)
Introduction, Board Physical Structure: SM PCB Aspect Ratio and Thickness, PCB
Base Material Option, Solder Resist Options, Mounting SM Assemblies into
Equipment,
4. SM PCB Layout Design Guidelines:- 10)
General Points on Component Positioning , Individual Component Proximity
Guidelines , Track Widths and Gaps, Termination of Fine Tracks at Solder Pads,
Leads not Used Electrically, Track Management, Fan-out and Proximity
Guidelines
5. Chemicals used in SMD PCB design: (06)
Solder Resist Specification and Aperture Design Selecting the Right Type of Solder
Resist:(i) Soldering Process, (ii) Component Types and Spacing on the Board, (iii)
Resist Thickness Requirements, (iv) PCB Material and Manufacturing Process Solder
Paste Application:- Methods of Solder Paste Reflow: (i) Screen Printing, (ii)
Dispensing
Design of Screen Apertures: (i) Controlling Printed Volume of Paste, (ii) Aperture
Design for Selected Mask Materials
20
6. Mounting Techniques and Design considerations:- (06)
Using Through-hole Components on Mixed Technology Boards: Layout
Guidelines, Use of Plugs and Sockets, Design Constraints due to SM Processes Some
Thermal Considerations:-Thermal Plot at CAD Stage, Locally Increasing Thermal
Conductivity of PCBs, Thermal Breaks Lead frames: SIL Versions, DIL Versions
Reference books:-
1. SURFACE MOUNT & MIXED TECHNOLOGY PCB DESIGN GUIDELINES
A Handbook for Professional Engineers
By David Boswell Electrochemical Publications, IOM, 1997-2005
2.AN INTRODUCTION TO PRINTED CIRCUIT BOARD TECHNOLOGY
by J. A. SCARLETT Electrochemical Publications, IOM, 1997-2005
3. Printed Circuit Board Designer's Reference: Basics.
Author CHRISTOPHER T. ROBERTSON
4. PCB Technology By Bosschart TataMcGraw Hill Pub.s
21
EL DT 08: Television and Systems
Aim and objective:
1. To make student aware of basic principles of video recording.
2. To make students understand the working of black and white and color television.
3. To make student aware of working principle of videodisc.
4. To understand principle of recording/replay of optical discs.
5. To make students familiar with working of VCD, DVD players.
6. To give general idea of systematic faultfinding of video systems.
1: Audio and Video signals and their origin. (12)
Conversion of picture information into electrical signal. TV camera black and white and
color. Camera adjustments. image oprthicon, vidicon and plumbicon camera tubes. Solid
state image sensor, PAL color signal and its encoding. Spectrum of PAL signal.
2: Scanning and composite video signal. (14)
Resolution of TV system. Picture information and video frequencies. Block
diagram of black and whiter and color TV systems, important circuits b/w and color
TV such as tuner, IF amplifier, video amplifier, AGC, Sync system, chroma section of
color TV etc. B/W and color TV picture tubes, flat panel displays plasma display,
LCD display, large screen displays.
Introduction to digital TV and HD TV
3: Recording of video signal (10)
magnetic tape need for FM of video signal, Need for rotating head
mechanism, Color recording and its problem. VHS tape format, Azimuth Recording,
Transverse and helical Scan. Block diagram and working of a VCR (VHS System)
Record and Replay electronics. Working of Tape And Head servo control systems.
4: Principle and working of Magnetic Video Disc (10)
CLV Vs CAV, CD encoding, CD making process, Optical Pickup Assembly, Servo
system and motor. Block diagram and working of CD Player, Block Diagram of MP3
player.
VCD: Construction and working, MPEG, Block Diagram and working of VCD player,
DVD: Construction and working principle, Block diagram of Player
5: Systematic Fault finding of Color TV (04)
Reference Books:
1. Video Handbook: Vazel and King
2. Basic TV and Video Systems: Grob, Herndon(McGraw Hill)
3. T. V. & Video Engg. : Dhake
4. Modern CD Player servicing Manual: Lotia, Nair, Varu BPB Pub.
5. Modern VCD Player : Lotia, Tonc BPB Publication
22
EL DT 09: Material properties & Fabrication techniques
Objectives:
1. To give general idea of various properties of materials.
2. To make student aware of various fabrication processes.
3. Design aspects of various components /devices correlated with properties of
materials.
1. Types of materials:(Introduction and list of materials in each type) (06)
Conductive, dielectric, resistive, insulating, semiconductor
Plastics, polymer
2. Material properties (in relation with above materials) (24)
Scope: Definitions, ranges of values, units of measurement
Physical properties: Orientation effects, defects- point defects, dislocation,
two-dimensional defects, specific gravity, entropy, and density.
Electrical properties: Conductivity, receptivity (DC, RF) superconductivity,
thermo electric phenomenon, and dielectric constant Dissipation factor, TCR,
vibration, Ferro electricity, anti Ferro electricity
Mechanical Properties: Modulus of elasticity tensile strength, elongation, yield
stress, yield strength, impact strength.
Optical properties: Optical constants & physical significance, reflection,
refraction, diffraction, scattering, dispersion.
Thermal Properties: Burning rate, heat dissipation, specific heat, thermal
expansion coefficient, maximum service temperature, melting
point, thermal conductivity, thermion work function, heat
capacity, evaporating temperature.
Magnetic Properties: permeability, losses, magnetization, acoustical properties .
Permittivity, strength, insulators and its properties,
breakdown, piezoelectric properties.
Chemical Properties: chemical resistance, resistance to oxidation.
3. Clean room techniques: Class of clean room, FAB lab & components of FAB
system (04)
4.Design and Fabrication Technology: (16)
Resistors and capacitors: Fabrication techniques – 1.bulk (wire, powder, flexes) 2.
Thin film 3. Thick films
Study of parameters-value, TCR, wattage, tolerance
Power and IF transformers: Fabrication techniques,
Study of parameters - turns ratio, stampings, efficiency.
Pn junction diode: Fabrication steps- crystal growth, doping, oxidation, diffusion, ion
implantation, lithography, metallization and etching.
Text Book:
1. Electronic Properties of Materials: R.E. Hummel
2. Electronic Properties of Materials: David Jiles
3. VLSI fabrication principles: S.K. Ghandhi
Reference books:
1) Electronic components & materials principles, manufacturing, maintenance:
-S. M. Dhir TMH
2) Principle of electronic material and devices - S. O. Kasap TMH
23
EL DT 10 BIOMEDICAL INSTRUMENTATION
OBJECTIVES:
1) To prepare awareness about biological signals, their measurements and
interpretation.
2) To understand the working principles of modern medical instruments.
3) To lay down specification and understand design methods for electronic circuits
used in medical instrumentation.
4) To understand the role of computers and programming in medical application.
5) To learn advanced image processing as applicable in medical imaging .
PREREQUISITES:
Advanced signal processing
Fourier series, Fourier transforms, Laplace transform of signals, Sampled data signals,
DFT, FFT, Auto Correlation, Cross- correlation of signals, Convolution filtering signal
sampling & reconstruction, Signal modulation, nonlinear and linear processing syllabus.
1. FUNDAMENTALS OF MEDICAL INSTRUMENTATION (4)
Anatomy and physiology, Physiological system of the body, Biomedical signals and their
sources. The need of biomedical instrumentation ,Basic medical instrumentation system
2. BIOMEDICAL TRANSDUCER (6 )
Classification of transducer, Performance characteristic of transducer, Transducer for
body temperature measurement, Displacement, position and motion transducer
Pressure transducer, Optical fiber sensors, Bio sensors, Smart sensor
3. BIOMEDICAL RECORDERS (8 )
Basic electronic recording system, Biomedical signals analysis techniques, Fourier
transform, Fast Fourier transform (FFT), Wavelet transforms, Electro cardiograph (ECG)
ECG leads; Microprocessor based multichannel ECG systems, Electroencephalograph
(EEG), Electromyograph (EMG), Other biomedical recorders, Ballistocardiograph
(BCG), Electro-oculograph (EOG), Electroretinograph (ERG)
4. PATIENT MONITORING SYSTEM (6)
Cardiac monitor, Measurement of heart rate, Measurement of pulse rate, Blood pressure
measurement, Measurement of respiration rate, Impedance pneumography
5. INSTRUMENTATION FOR BLOOD (6)
Blood flow meters, Ultrasonic Blood flow meters, Laser Doppler Blood flow meters
Blood gas Analyzer, Blood pH measurement, Blood cell counters, and Types of blood
cells
Methods of cell counting
6. OPTHALMOLOGY AND AUDIOLOGY INSTRUMENTATION (6)
Audiometer, Acoustic impedance meter, Evoked response audiometer, Automated
perimeter, Funds reflectometer, Tonometer, Eye’s movement measurement
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7. THERAPEUTIC EQUIPMENTS (4 )
Cardiac pacemaker, Surgical diathermy machine , Ultrasonic therapy unit , Dialyzers
Modern lithotriptor systems, Anesthesia machine, Ventilators, mechanics of respiration,
Modern ventilators. Radiotherapy instruments
8. MEDICAL IMAGING SYSTEMS (6)
Basic of Diagnostic Radiology, X-Rays & Properties of X-ray, X-ray machine, Dental Xray
machine, CT scanner, Gamma camera, Nuclear magnetic resonance (NMR) system,
Echocardiograph.
9. BIO-TELEMETRY (4)
Introduction, Physiological parameters, Components of bio-telemetry system
Implantable units, Applications of telemetry in patient care
BOOKS RECOMMENDED
1. Handbook of Biomedical instrumentation
R.S Khandpur -Tata Mc Graw Hill (2001)
2. Biomedical instrumentation and measurement (2nd Edition )
Cromwell, wiebell, Pfeiffer. PHI ,Delhi (1996)
3. Medical instrumentation : Application and design (Third Edition)
John G.Webster - John Willey & Sons (1998)
25
EL DT11 : Electronics & Computers in Agriculture
1. Basics of Agriculture: 12
Introduction to Soil Science- Soil structure, Soil properties, Soil processes Formation of
Soil, types of soils, Organisms and soil processes, Soil as a medium for plant growth, Soil
moisture & efficiency soil pH values and crop production
Chemical analysis of soil, water bearing capacity, Soil erosion and conservation,
measurement of soil parameters.
Introduction to Crop Science- Elementary crop science, Basic principles and advances
in photosynthesis. Paste and disease management, Post harvesting, Role of fertilizers,
Different types of crops. (Floriculture, Horticulture , Mushroom culture, etc.)
2. Agriculture equipments and Automation: 18
Introduction to agriculture measurement techniques,: Agricultural parameters
(Temperature, pH, Conductivity, Salinity, Soil Moisture,) operating principles of sensors
and actuators for Agriculture, Measurement of temperature, Measurement of pH and
conductivity, Soil analysis and soil testing, soil moisture measurement, Introduction to
Agro meteorology: RH, Wind speed and direction, Radiation, rain Agro meteorological
instruments: Anemometer, Use of PLDs, Microprocessors and Microcontroller, Data
converters, Display devices, in agricultural automation.
Use of opto-electronic devices for measurement and control of physical
parameters in agri- electronics, Salinity tester, specific ion analyzer, field
usable , pH meter. Agricultural equipment and automation, Automatic drip irrigation.
3. Computers & Special Information technology in Agriculture: 12
SIT, GIS/ GPS software’s Applications for Ground water modeling, crop forecasting &
estimate, soil erosion etc, Use of Digital Image processing, Satellite missions, Hyper
spectral remote sensing, physics of optical & microwave remote sensing, thermal
mapping.
Simulators used for study of crop growth. Data logger, features of data loggers, data
loggers for dedicated use in agriculture, Computer based automatic weather station.
4. Green House Instrumentation: 08
Green House Instrumentation: Green House Technology introduction, instrumentation
required for tissue culture techniques, Use of simple electronic circuits for control for
physical parameters like temperature, humidity and irrigation, and indication of physical
parameters.
References:
1. Treaties on Agro-Physics & Agri electronics : Dr. G.N. Acharya & Dr. D.G.
Hapse
2. Fundamentals of remote sensing: George Joseph
3. Fundamentals of Soil: V.N. Sahi- Kalyani Publication
Principles of Agricultural Engineering – A.M. Michale
4. Spatial information technology I.V. Muralikrishna Vol I & II BS Pub.
26
EL DT 12 Automotive Electronics
1. Introduction to Automotive electronics [15]
Engine management system (EMS), Power train
Driver assistant modules – night vision, cruse control, intelligent control
Body control Modules – Power window, central locking, interior and
exterior lighting, heating / cooling (ac approaches inside vehicle), seat
movement, steering angle movement
Immobilizers, security systems (Theft alarms
Infotainment – Music system, GPRS, hands free telephony, other
Entertainments
2. Microcontrollers used in automotives [15]
Free scale Infenion (16 – 32 bit, Dual core, tri-core) engine management.
Selection criterion of microcontrollers in automotive applications, Specific
applications e.g. start 12 series – free scale, NEC-V850 widely used in
automotive
3. Automotive Networks [10]
CAN Communication, LIN, MOST (used for entertainment), sensors,
FLEX RAY
4. Awareness of Industrial Tools for testing these Networks – [10]
Simulation software, vector informatics tools, CAN analyzer (Hardware
and software), LABVIEW, Software architecture - AOTOSAR
(Automotive software architecture)
Reference: Automotive web sites, Manuals, Books to be searched on google.
27
EL DT 13 DSP systems and applications
Prerequisite : Background study / Knowledge of Laplace Transform is essential .
Objectives:
After studying this course student will
1. Learn basics of signals.
2. Learn designing of filters & basics of DSP processor.
3. Understand Processor architecture, DSP based hardware design and application.
1 : Electronic Signals and Systems (06)
Concept of signal and signal processing , classification of signals , CT and DT ,
deterministic and non-deterministic , periodic and aperiodic , even and odd , energy and
power signals etc. Singularity functions for signals.
Classification of systems , static and dynamic , linear and non-linear , Time variant and
Time invariant , casual and non-casual , stable and unstable.
2 : Fourier Analysis of Signals (10)
Fourier series representation of CT signals , trigonometric , polar and exponential
forms of Fourier series , Direchlet conditions , Continuous Time Fourier Transform ,
Concept of Amplitude and phase spectrum of CT signals.
Discrete Time Signals , Discrete Fourier Transform , Inverse DFT , Fast Fourier
Transform , Radix 2 algorithms for FFT , Amplitude and Phase spectrum of DT
signals.
3 : Time and Frequency Domain analysis of DT signals (12)
Z-transform , Inverses Z-transform , difference equation and its solution , concept of
transfer function of DT system, Impulse response , Time and frequency domain
analysis of DT system using transfer function , concept of realization of transfer
function.
DT filters , Impulse Invariant and BLT method for designing of DT filters , IIR and
FIR filters , Concept of convolution and co-relation , brief introduction of window
technique for DT filters
4 : Digital Signals and Systems (06)
Analog to Digital conversion of signals , concept of sampling of CT signals ,
Shanon’s Sampling Theorem , Nyquist frequency , Aloasing effect , antialising
filters , concept of quantization and quantization error , encoding . Block diagram
representation of a DSP system , Practical A/D and D/A converters.
5 : Digital Signal Processing (08)
. Digital signal processor Architecture , Multiplier and Accumulators, ALU and
Barrel shifter , Memory and Cachey, Registers , Buses , peripheral interfaces ,
circular Buffers , specialized Hardware , Bit reversal , Timer , Counters , Clock and
PLL , power supply , Real Time and Off-line processors , Manufacturers of Digital
Signal Processors , packaging of Digital Signal Processors.
28
6 : Applications of DSP : (06)
Qualitative information with block diagram representation (and numerical exercises
wherever necessary) of the following applications be given.
Filtering, Modulation. Demodulation, Motion control and positioning,
seismography , Radar , Sonar , noise reduction and echo cancellation , speech
recognition, interference rejection, image processing.
Books –
1. Digital Signal Processing: S. Salivahan, A. Valuraj, C.Gnanapriya, Tata McGraw Hill
Pub. Co. Ltd. Edn. 2006.
2. Digital Signal Processing: A Hands on Approach: Charles Schuller, Mahesh Chugani,
Tata McGraw Hill Pub. Co. Ltd. Edn. 2006.
3. Digital Signal Processing: - Principles, Algorithms and Applications: John G Proakis,
Dimitris G Monolkis, and Pub. Person 2005.
29
M.Sc. Electronic Science Part II ( From June 2009)
EL3UP05 Practical Course V
Total Experiments to be performed 12
Embedded Systems 4 + Process Control 4 + Department course 4
( As listed below)
Group A : Embedded Systems
6. Basic Assembly language programs for 8-bit microcontroller.
Signed and unsigned arithmetic, Code conversions, String manipulations
7. Design of 8- bit microcontroller Target board
Clock circuit, Reset circuit, buffers, port expansion, programming facility
8. Interfacing to 8-bit microcontroller (keyboard and LCD display)
9. Use of cross compiler (Writing a program in ‘C’ for 8 bit Microcontroller-ADC 0804
interfacing).
10. PWM Motor control with CCP(Compare Capture Pulse-Width-Modulation) using PIC.
11. Flash programming techniques- Phillips, Atmelserial ISP, Parallel Programming. To
verify simple assembly programs Square wave generator/ frequency counter/ Relay
Group B : Process Control
To design and test proportional controller .
To design and test PI controller.
3. Simulate the event sequence for operation of washing machine/ coffee
vending machine/ bottle filling plant using PLC simulator.
4 To test the event sequence for operation of washing machine/ coffee
vending machine/ bottle filling plant using PLC module.
5 Study of Stability of control system.(temp/flow)
Open loop transient response method OR Zigler Nichols method
6. Study the effect of capacity of process on cyclic response of an on-off controller.
12. To study the position / velocity control of dc servo motor.
Department Course –
Note : Any 04 practical corresponding to departmental course at the center.
1. Design & Simulation of R & various parameters- tolerance, thin film TCR,
high frequency resistance.
2. To design, built and test buck regulator.
3. Develop a program in C / MATLAB to understand various image processing
techniques. Sharpening of image
a) Edge detection in the image.
b) Blurring of the image
c) Contrast adjustment
d) Image embossing
e) Enlarge and reduce
4. Study of Actuators and their driving circuit. Different types of motors and solenoids.
5. Draw a schematic using Orcad /Protel/MicroSim, Simulate the circuit and
Design a single/double layer PCB layout for Regulated power supply using
IC regulators (78xx, 79xx). (Analog circuit PCB).
6. To measure moisture content in seeds/ grains (Using capacitive sensor)
7 Pulse rate measurement
8 Optical fiber sensor
9 IIR filters Design using Bilinear Transform: Low pass Filter, High pass Filter.
10. Serial EPROM interface using I2C protocol.
11 Study of cable TV system.
30
EL3UP06 Practical Course VI
Total Experiments to be performed 12
Any Four from each Department course ( 3 x 4 =12) conducted at the centre
Group C : Data Communication and Networking EL DT 01
1. Study of different error detection and correction codes.
2. Study of LAN topology.
3. Setting of LAN for two nodes. (Server & Nodes)
4. Using Client Server network.
5. Setting of peer to peer network.
6. Using peer to peer network.
Group D : Opto electronics ELDT02
1. Optical Fiber parameter testing
2. Mode field diameter
3. LASER beam Profile
4. LED profile
5. Optical position encoder
6. Setting up fiber optic voice link
7. Design Build & test digital data communication system
Group E : Advanced Power Electronics ELDT03
1. Designing of testing of Boost converter and Buck Boost converter.
2. Stepper motor control using PWM
3. AC motor control
4. DC power supply using fly back / forward / half bridge / full bridge converter
5. Emergency light control
6. Measurement of transformer parameters
7. Motor control using PWM
8. Simulation using PS-SPICE (for converter, inverter, rectifiers, etc.)
9. Design and study of Integral half cycle/full cycle control.
10. Study of synchronous motor drive
Group F : Mechatronics ELDT04
1. Study of kinematics (position, velocity etc) for a robotic system.
2. Study of different types of robots.
3. To build and test a 1D robotic arm.
4. To build and test a 2D and 3D robotic arm.
5. To test, build and control a robotic vehicle.
6. Study of application of fuzzy logic and artificial intelligence in robotics.
Group G : Advanced Embedded Systems ELDT05
1. Basic Assembly language programs for 16/32-bit microcontroller.
2. Interfacing LCD to 16/32 bit microcontroller
3. Interfacing key board to 16/32 bit microcontroller
4. Serial EPROM/EEPROM interface using SPI protocol.
5. Interfacing external interrupt.
6. Interfacing DAC to 16/32 bit microcontroller
7. Interfacing ADC to 16/32 bit microcontroller
31
Group H : Digital Image Processing EL DT 06
1. Design of API using V2.
2. Study of various available image processing software for performing
various operations on a given image.
3. Read and display different image files:-
BMP, GIF, TGA, TIFF, PCx, JPEG.
Group I : PCB design ELDT07
1. Draw a schematic using OrCAD /Protel/MicroSim and Design a single/double layer
PCB layout for Memory interface with 8051 microcontroller. ( Digital circuit PCB).
2. Draw a schematic using OrCAD/Protel/MicroSim and Design a single/double layer
PCB layout for interfacing ADC with Microcontroller.(Analog + Digital PCB).
3. Draw a schematic using OrCAD/Protel/MicroSim and Design a single/double layer
PCB layout for transistorized AM receiver circuit. (RF circuit PCB).
4. Draw a schematic using OrCAD/Protel/MicroSim and Design a single/double layer
PCB layout for Instrumentation Amplifier using SMD components.(SMD components
circuit PCB)
5. Draw a schematic using Orcad /Protel / MicroSim, Simulate the circuit and
Design a single/double layer PCB layout for CE amplifier, 2-stage RC
coupled transistorized amplifier. (Analog circuit PCB).
Group J : Television and Systems ELDT8
1. Circuit tracing and studying of waveforms at different test points of a B/W
TV Receiver. Compare Faulty and Proper waveforms.
2. Circuit tracing and studying of waveforms at different test points of a Colour
TV Receiver.
3. Study of SMPS of a Colour TV
4. Maintenance & Troubleshooting of a VCR
5. Maintenance & Troubleshooting of a CD player( VCD, DVD etc)
Study of a chroma section waveform in a c
Group K : Material Properties & Fabrication techniques ELDT09
Refractive index measurements using Ellipsometer o f thin films
Design and simulation of R- tolerance, thin film and thick film, TCR, high frequency
resistance (frequency dependent/frequency independent)
Magnetic Properties- IF Frequency response characteristics transformer, hysteresis
Young’s Modulus – Cantilever (Pressure sensors)
Group L : Biomedical instrumentation ELDT10
1) Heart rate counter
2) Electronic stethoscope.
3) Blood pressure Measurement.
4) Interfacing transducer signals to the N-controller / N-processor
5) Measurement of Skin contact impedance using surface electrodes
6) Bed - side patient monitoring system
7) Pace maker
32
Group M : Electronics & Computers in Agriculture ELDT11
1. Measurement of soil parameters (pH, conductivity, moisture )
2. Measurement of meteorological parameters (wind speed, wind direction, temp.)
3. Use of GPS software to gather data related agriculture
4. Development of automation for green house parameters using microcontroller / PLC.
5. Development of automated drip irrigation system using microcontroller / PLC.
6. To design, built and test temperature controller for green house applications.
Group N: Automotive Electronics EL DT12
1. Study and analysis of central lock system used for cars.
2. Study and analysis of Power window system for car doors
3. Design and test automatic wiper system with respect to raining.
4. Study of Automotive communication network for internal environmental control
5. Study of CAN bus and its application in automobile.
Group O: DSP systems and Applications EL DT 13
Matlab/ C/ Code composer studio (any 2)
1. Basic Practical on Signals using Code to generate unit Impulse, unit step,
exponential sequence, sinusoidal sequence
2. Moving average filter: smoothing random variation in data
3. Convolution: Linear, Circular
4. Image processing
Filter designing using DSP processor (any two)
IIR filters Design using Bilinear Transform: Band pass, Filter Notch filter
FIR filters Design using Window method: Low pass Filter, High pass Filter, Band
pass Filter Notch filter
Filter realization
Speech processing
EL3UP 07 Project Course I
EL3UP 08 Project Course II
Project Guide lines
Format of the project course
The project work is to be carried out in light of following guidelines in TWO SEMESTERS.
SEM -III:
The Detail Contents Are As Follows:
1. Preparation of the Synopsis & Presentation
2. Literature Review
3. Time Schedule
4. Resource Planning Comprises:
· Preparatory experiments
· Hardware experiments
· Software experiments: Algorithms, flow charts, Coding of the project work
using selected programming language.
SEM IV:
5. Paper planning or Paper writing and presentation skills
6. Report / file of each module should be maintained by the student.
Note: overall the examiner should evaluate performance of the student by considering his/her
internal performance during the year.
Distribution of total 100 Marks is as under:
· Internal marks: 20
· External marks: 80
33
M.Sc. Electronic Science Syllabi
Non-credit courses
Purpose:
i) To enhance linguistic skills necessary for overall development and effective
communications.
ii) To get preliminary knowledge about technical documentation, project proposals.
iii) To get introduced to the concepts of entrepreneurship development, management
techniques.
iv) To learn interview techniques
Non-Credit Courses
1. Development of Scientific Writing Skills
Activities:
· Workshop of approximately 10 lectures of 90 minutes (Distributed on Sundays
or once in a month) to be conduced by center
· Or one time workshop of 3 days.
· Assignments to be handled in workshop
1. Lab and instrument manual
2. Project Report
3. Project Presentation Slides
4. Research Papers
5. Thesis writing
Common workshop can be held for entire M.Sc. II (of 60/70 students) or at individual
Institution / college/ University.
2. Entrepreneurship development:
Activities:
· Identification of opportunities of self employment in the field of electronics
· To visit a Government financial institute which provides financial support
for SSI
· Interview of successful entrepreneur.
· Center should arrange a lecture/ workshop of successful entrepreneur.
3. Language skill development
Activities:
1. To read at least three books (novels, stories, scientific fictions etc.) and submit
summary (worth 5 pages) of each book. Summary should include the individual
remarks about the book in general.
2. To prepare the collection of articles about a particular topic (say a theme) These
articles may from newspapers, magazines, special issues, journals etc. They should
be of general knowledge type without going into the complexities or mathematics of
the topic. The collection should be arranged in a sequence to give completeness. It
should have the comments of the students.
34
4. Personality Development
Activities:
1. Introducing One self
2. Writing Bio data
3. Facing interviews
4. Participating in Group Discussion
5. Methods to improve confidence and commutation skills
6. Preparing for open defenses or oral examination or participating in seminar
7. Collecting information about Address, reference, personalities, institutions
8. Planning a small study tour/arranging Welcome and sendoff functions
Introduction to a Function/ to a Chief Guest/ Vote of Thanks
9. Listening, speaking, reading, writing skills
10. Library and reference skills
11. Dramatization of a particular theme
12. Interpreting technical, advertisement/document
13. Hobbies
14. Social awareness
Lectures/Seminars/workshop should be conducted by college.
ÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈÇÈ